PCB

Future Assembly Solutions provides assemblies for single layer thru-hole boards to complex multilayer with BGAs and LCCs.

Complete TPH (thru pin hole) capability ROHS and Non-ROHS.

Complete capability, which includes BGA, 0201,0402 and other types of component placement.

Complete SMT capability, from high speed chip shooter to an odd pick and place machine which gives us the ability to place thru-hole parts with GSM.

Our Strengths:

• Local manufacturing which makes our lead time for prototype 1 to 5 days.

• Our lead time for mid volume is 2 weeks.

• Turnkey or consigned.

• Physical sizes on PCB can range from 1”X1” to 14.5X19.5” through our standard process.

• For any size above or below the standard size, we will handle with our special process capabilities.